New requirements are emerging in electronics packaging. RF components need to support higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect challenges and the emergence of IoT will drive the needs for trillions of tiny sensors. Simultaneously, there is continuous search for more cost-effective solutions to difficult packaging challenges.
Corning semiconductor glass wafers can help address these challenges.
Corning's Semiconductor Glass Substrates
Products
Carrier
Carrier Glass
Learn MoreGlass has several benefits that make it an excellent alternative to silicon or metal carriers used during the semiconductor manufacturing process.
- Portfolio of CTEs: Corning offers a broad portfolio of CTEs, from 3.2ppm/°C – 12.4ppm/°C, allowing our customers to tailor the CTE of their carrier match their process needs. This is especially important for the emerging FO-WLP market.
- Flat: Corning Semiconductor Glass Wafers have very low warp and total thickness variation (TTV), which is ideal for carrier applications and helps minimize yield loss
- Transmission: Because glass is highly transparent, customers can use a laser de-bond process to potentially increase their throughput.
- Portfolio of CTEs: Corning offers a broad portfolio of CTEs, from 3.2ppm/°C – 12.4ppm/°C, allowing our customers to tailor the CTE of their carrier to match their process needs. This is especially important for the emerging FO-WLP market.
- Flat: Corning Semiconductor Glass Wafers have very low warp and total thickness variation (TTV), which is ideal for carrier applications and helps minimize yield loss
- Transmission: Because glass is highly transparent, customers can use a laser de-bond process to potentially increase their throughput.
TGV
TGV
Learn MoreCorning offers precision glass with precision vias, which is ideal for RF and interposer applications. Corning glass can help the semiconductor industry achieve smaller package size, better performance and lower cost of ownership.
- Glass is an insulator and has very low electrical loss, particularly at high frequencies
- High stiffness and ability to adjust the CTE offer advantages for most semiconductor applications
- Precision Through Glass Vias (TGV) can be used to re-route an electrical connection and can even be used to form an inductor in glass
- Panel form factor and ability to be as thin as 100um offers significant opportunity for process optimization
Corning offers precision glass with precision vias, which is ideal for RF and interposer applications. Corning glass can help the semiconductor industry achieve smaller package size, better performance and lower cost of ownership.
- Glass is an insulator and has very low electrical loss, particularly at high frequencies
- High stiffness and ability to adjust the CTE offer advantages for most semiconductor applications
- Precision Through Glass Vias (TGV) can be used to re-route an electrical connection and can even be used to form an inductor in glass
- Panel form factor and ability to be as thin as 100um offers significant opportunity for process optimization
Interesting Fact
Did You Know?
Did You Know?
Did you know glass is an insulator and has a low loss tangent, leading to less electrical loss?
Did you know glass is an insulator and has a low loss tangent, leading to less electrical loss?
Technical Papers and Presentations
White Papers and Presentations
Progress and Application of Through Glass Via (TGV) Technology
Authored by: Aric B. Shorey and Rachel Lu
Advancements in Glass for Packaging Technology
Presented by: Kevin Adriance
Leveraging Glass for Advanced Packaging and lot
Presented by: Aric B. Shorey
Upcoming Events and Presentations
Interested in learning more?
Interested in learning more?
Contact UsIf you are interested in additional information about Corning Semiconductor Products, contact us to reach a sales team member.
If you are interested in additional information about Corning Semiconductor Products, contact us to reach a sales team member.