Semiconductor chip makers use single-crystal silicon to develop the highest performance computer chips and devices. Today, silicon films are already added to glass substrates via complex processing techniques, but they are not purely "crystalline silicon," are not uniform, and have limited performance and functionality.
Corning is developing a process to bond high-quality silicon wafers onto glass, providing substrates which will be useful for growing electronic circuits, and appropriate for special semiconductor, display and imaging applications. This emerging technology is known as silicon on glass (SiOG).
Corning’s SiOG technology will enable high image resolution, full-motion video and low-power consumption for mobile electronics and other devices.
For more information on Corning's silicon-on-glass technology, view a video or flash tutorial.